Micron’s $100B Syracuse Megafab Will Reshape US Chip Production by 2030
Micron Technology has started building a massive semiconductor complex in Syracuse, New York. The project marks the largest private development in the state’s history, with plans to invest up to $100 billion over the next two decades. Construction began in 2024, with the first plant set to open by 2030.
Work on the site kicked off in late 2024, starting with land preparation. Crews cleared 445 hectares of forest and moved millions of cubic metres of gravel to level the ground. Tool installation for the first facility, Fab 1, will begin in 2025, with production ramping up the following year. Construction of Fab 2 starts in 2026, while Fab 3 breaks ground in 2028. All three plants should reach full capacity by 2030, with a fourth facility planned for later phases.
To support the massive build, Micron is funding major infrastructure upgrades. A new industrial wastewater treatment plant, power grid expansions, and water supply improvements are underway. The company is also constructing a rail spur to transport materials and redesigning local roads, including new highway exits. State funding has been secured for the first two plants, though financing for the remaining facilities remains undecided.
The project will roll out in stages, with additional plants scheduled to open in 2033, 2038, and 2041. Once complete, the complex is expected to create 9,000 direct jobs and up to 40,000 indirect roles over 20 years.
The Syracuse megafab will transform the region’s economy and infrastructure. With operations beginning in 2030, the facility aims to boost domestic semiconductor news production. The full $100 billion investment will unfold over decades, depending on future funding and market conditions.
